Assignee
MCMILLAN JOHN ROBERT
US·3 granted patents·2 citations·filing 2011–2011
Top patents by PatentIndex Score
3 records- 0159US8513786B2Pre-bonded substrate for integrated circuit package and method of making the sameMCMILLAN JOHN ROBERT·Filed 2011·Granted Aug 20, 2013·1 cites·23 claims
- 0257US8338924B2Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereofMCMILLAN JOHN ROBERT·Filed 2011·Granted Dec 25, 2012·1 cites·24 claims
- 0344US8569110B2Pre-bonded substrate for integrated circuit package and method of making the sameMCMILLAN JOHN ROBERT·Filed 2011·Granted Oct 29, 2013·0 cites·32 claims
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