Assignee
MCELREA SIMON J S
US·5 granted patents·140 citations·filing 2008–2012
Top patents by PatentIndex Score
5 records- 0197US8178978B2Support mounted electrically interconnected die assemblyMCELREA SIMON J S·Filed 2009·Granted May 15, 2012·77 cites·38 claims
- 0293US8723332B2Electrically interconnected stacked die assembliesMCELREA SIMON J S·Filed 2008·Granted May 13, 2014·35 cites·38 claims
- 0393US8629543B2Electrically interconnected stacked die assembliesMCELREA SIMON J S·Filed 2010·Granted Jan 14, 2014·19 cites·29 claims
- 0486US9305862B2Support mounted electrically interconnected die assemblyMCELREA SIMON J S·Filed 2012·Granted Apr 5, 2016·7 cites·17 claims
- 0567US8324081B2Wafer level surface passivation of stackable integrated circuit chipsMCELREA SIMON J S·Filed 2011·Granted Dec 4, 2012·2 cites·9 claims
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