Assignee
MAEDA SHINNOSUKE
JP·17 granted patents·1 pending application·78 citations·filing 2009–2012
Top patents by PatentIndex Score
18 records- 0193US8530751B2Multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted Sep 10, 2013·21 cites·20 claims
- 0288US8946906B2Multilayer wiring substrate and method of manufacturing the sameMAEDA SHINNOSUKE·Filed 2011·Granted Feb 3, 2015·11 cites·15 claims
- 0386US8129828B2Wiring substrate with reinforcementMAEDA SHINNOSUKE·Filed 2009·Granted Mar 6, 2012·15 cites·20 claims
- 0483US8389871B2Multilayered wiring board and method of manufacturing the sameMAEDA SHINNOSUKE·Filed 2011·Granted Mar 5, 2013·6 cites·9 claims
- 0582US8707554B2Method of manufacturing multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2010·Granted Apr 29, 2014·6 cites·6 claims
- 0680US8581388B2Multilayered wiring substrateMAEDA SHINNOSUKE·Filed 2010·Granted Nov 12, 2013·6 cites·15 claims
- 0777US8233289B2Multilayer wiring substrate and method for manufacturing the sameMAEDA SHINNOSUKE·Filed 2010·Granted Jul 31, 2012·4 cites·9 claims
- 0865US8609995B2Multilayer wiring board and manufacturing method thereofMAEDA SHINNOSUKE·Filed 2011·Granted Dec 17, 2013·3 cites·16 claims
- 0965US8450617B2Multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted May 28, 2013·2 cites·5 claims
- 1064US8847082B2Multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted Sep 30, 2014·1 cites·10 claims
- 1164US8535546B2Method of manufacturing multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted Sep 17, 2013·2 cites·11 claims
- 1259US8826526B2Method of manufacturing multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted Sep 9, 2014·1 cites·7 claims
- 1346US9006580B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2012·Granted Apr 14, 2015·0 cites·10 claims
- 1446US8772643B2Multilayer wiring substrate, and method of manufacturing the sameMAEDA SHINNOSUKE·Filed 2011·Granted Jul 8, 2014·0 cites·7 claims
- 1539US8859077B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted Oct 14, 2014·0 cites·10 claims
- 1639US8658905B2Multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted Feb 25, 2014·0 cites·7 claims
- 1739US2012097319A1Method of manufacturing multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Application pending·0 cites
- 1836US8450622B2Multilayer wiring substrate and method of manufacturing the sameMAEDA SHINNOSUKE·Filed 2011·Granted May 28, 2013·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when MAEDA SHINNOSUKE files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →