Assignee
MA QING
US·11 granted patents·6 pending applications·131 citations·filing 2004–2025
Top patents by PatentIndex Score
17 records- 0198US9368429B2Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chipsMA QING·Filed 2012·Granted Jun 14, 2016·86 cites·16 claims
- 0294US8207453B2Glass core substrate for integrated circuit devices and methods of making the sameMA QING·Filed 2009·Granted Jun 26, 2012·28 cites·13 claims
- 0383US9297824B2Techniques, systems and devices related to acceleration measurementMA QING·Filed 2012·Granted Mar 29, 2016·4 cites·16 claims
- 0475US9420707B2Substrate for integrated circuit devices including multi-layer glass core and methods of making the sameMA QING·Filed 2009·Granted Aug 16, 2016·5 cites·9 claims
- 0574US2025387293A1Massage DeviceMA QING·Filed 2025·Application pending·0 cites
- 0671US10070524B2Method of making glass core substrate for integrated circuit devicesMA QING·Filed 2012·Granted Sep 4, 2018·2 cites·4 claims
- 0770US9445496B2Glass clad microelectronic substrateMA QING·Filed 2012·Granted Sep 13, 2016·2 cites·30 claims
- 0869US8513966B2Probes formed from semiconductor region viasMA QING·Filed 2010·Granted Aug 20, 2013·2 cites·10 claims
- 0965US8338813B2Bit-erasing architecture for seek-scan probe (SSP) memory storageMA QING·Filed 2009·Granted Dec 25, 2012·0 cites·25 claims
- 1050US8068405B2Ferroelectric memory and method in which polarity of domain of ferroelectric memory is determined using ratio of currentsMA QING·Filed 2007·Granted Nov 29, 2011·2 cites·20 claims
- 1149US9429427B2Inductive inertial sensor architecture and fabrication in packaging build-up layersMA QING·Filed 2012·Granted Aug 30, 2016·0 cites·17 claims
- 1249US2007013023A1Isolation structure configurations for modifying stresses in semiconductor devicesMA QING·Filed 2006·Application pending·0 cites
- 1347US8637778B2Debond interconnect structuresMA QING·Filed 2010·Granted Jan 28, 2014·0 cites·10 claims
- 1446US2008142859A1Methods of forming ferroelectric media with patterned nano structures for data storage devicesMA QING·Filed 2006·Application pending·0 cites
- 1544US2007000305A1Gas phase chemical sensor based on film bulk resonators (FBAR)MA QING·Filed 2005·Application pending·0 cites
- 1640US2011156406A1Platform energy harvestingMA QING·Filed 2010·Application pending·0 cites
- 1736US2005248420A1Forming integrated plural frequency band film bulk acoustic resonatorsMA QING·Filed 2004·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →