Assignee
LPKF LASER & ELECTRONICS AG
US·35 granted patents·14 pending applications·437 citations·filing 1996–2023
Top patents by PatentIndex Score
49 records- 0194US7060421B2Conductor track structures and method for production thereofLPKF LASER & ELECTRONICS AG·Filed 2004·Granted Jun 13, 2006·166 cites·16 claims
- 0290US7540934B2Method and apparatus for irradiation welding of two thermoplastic componentsLPKF LASER & ELECTRONICS AG·Filed 2005·Granted Jun 2, 2009·23 cites·10 claims
- 0390US6696173B1Conducting path structures situated on a non-conductive support material, especially fine conducting path structures and method for producing sameLPKF LASER & ELECTRONICS AG·Filed 1998·Granted Feb 24, 2004·120 cites·29 claims
- 0487US7510985B1Method to manufacture high-precision RFID straps and RFID antennas using a laserLPKF LASER & ELECTRONICS AG·Filed 2005·Granted Mar 31, 2009·21 cites·23 claims
- 0582US10300664B2Method and a device for the welding of two parts to be joined made of thermoplastic synthetic materials along a weld seam by means of laserLPKF LASER & ELECTRONICS AG·Filed 2015·Granted May 28, 2019·4 cites·23 claims
- 0681US9924601B2Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layerLPKF LASER & ELECTRONICS AG·Filed 2013·Granted Mar 20, 2018·5 cites·14 claims
- 0777US5955179ACoating for the structured production of conductors on the surface of electrically insulating substratesLPKF LASER & ELECTRONICS AG·Filed 1996·Granted Sep 21, 1999·60 cites·20 claims
- 0876US12365051B2Method and device for providing through-openings in a substrate and a substrate produced in said mannerLPKF LASER & ELECTRONICS AG·Filed 2023·Granted Jul 22, 2025·0 cites·21 claims
- 0972US9764978B2Method and device for separating a substrateLPKF LASER & ELECTRONICS AG·Filed 2014·Granted Sep 19, 2017·2 cites·15 claims
- 1064US11618104B2Method and device for providing through-openings in a substrate and a substrate produced in said mannerLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Apr 4, 2023·0 cites·25 claims
- 1164US6596966B1Method for making a marking in a glass bodyLPKF LASER & ELECTRONICS AG·Filed 1999·Granted Jul 22, 2003·21 cites·4 claims
- 1261US11401194B2Method and device for separating a substrateLPKF LASER & ELECTRONICS AG·Filed 2017·Granted Aug 2, 2022·0 cites·3 claims
- 1358US11377387B1Method for producing microstructures in a glass substrateLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Jul 5, 2022·0 cites·14 claims
- 1458US10610971B2Method for producing recesses in a substrateLPKF LASER & ELECTRONICS AG·Filed 2014·Granted Apr 7, 2020·0 cites·20 claims
- 1557US12030079B2Device and method for depositing liquid on carriersLPKF LASER & ELECTRONICS AG·Filed 2022·Granted Jul 9, 2024·0 cites·27 claims
- 1656US2023250376A1Device and method for cell cultivationLPKF LASER & ELECTRONICS AG·Filed 2022·Application pending·0 cites
- 1755US12252436B2Single-piece reaction vessel made of glass, production method, and analysis methodLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Mar 18, 2025·0 cites·7 claims
- 1854US11505495B2Method for microstructuring a glass substrate by means of laser radiationLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Nov 22, 2022·0 cites·7 claims
- 1954US11072041B2Method for producing a technical maskLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Jul 27, 2021·0 cites·21 claims
- 2052US11065716B2Method for processing, in particular separating, a substrate by means of laser-induced deep reactive etchingLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Jul 20, 2021·0 cites·12 claims
- 2151US11156774B2Optical component and method for the production thereofLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Oct 26, 2021·0 cites·22 claims
- 2250US11446879B2Apparatus for joining, in particular laser welding, two components, and operating method for such a joining apparatusLPKF LASER & ELECTRONICS AG·Filed 2019·Granted Sep 20, 2022·0 cites·17 claims
- 2350US7559152B2Method for determining the position of a milling tool and a machining head designed for carrying out the methodLPKF LASER & ELECTRONICS AG·Filed 2006·Granted Jul 14, 2009·2 cites·10 claims
- 2450US6765176B2Apparatus for treating materials by means of a laser beamLPKF LASER & ELECTRONICS AG·Filed 2002·Granted Jul 20, 2004·5 cites·9 claims
- 2550US2007247822A1Method for the production of a printed circuit structure as well as a printed circuit structure thus producedLPKF LASER & ELECTRONICS AG·Filed 2007·Application pending·0 cites
- 2648US11478880B2Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching processLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Oct 25, 2022·0 cites·9 claims
- 2748US2016002791A1Method for producing an electrically conductive structure on a non-conductive substrate material, and additive and substrate material intended thereforLPKF LASER & ELECTRONICS AG·Filed 2013·Application pending·0 cites
- 2847US12398066B2Method for producing a display having a carrier substrate, a carrier substrate produced according to said method, and a cover glass intended for a flexible displayLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Aug 26, 2025·0 cites·15 claims
- 2947US2023026070A1Method for producing an electrically conductive structureLPKF LASER & ELECTRONICS AG·Filed 2020·Application pending·0 cites
- 3046US11851366B2Site-specific connecting of glass substratesLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Dec 26, 2023·0 cites·14 claims
- 3146US11613803B2Use of a component in a composition, composition for laser transfer printing, and laser transfer printing methodLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Mar 28, 2023·0 cites·10 claims
- 3246US11383972B2Method for producing microstructuresLPKF LASER & ELECTRONICS AG·Filed 2019·Granted Jul 12, 2022·0 cites·16 claims
- 3346US2015298391A1Method for joining a joining partner of a thermoplastic material to a joining partner of glassLPKF LASER & ELECTRONICS AG·Filed 2013·Application pending·0 cites
- 3445US2023192535A1Method for introducing a recess into a substrateLPKF LASER & ELECTRONICS AG·Filed 2021·Application pending·0 cites
- 3544US2024254036A1Substrate for liquid dropletsLPKF LASER & ELECTRONICS AG·Filed 2020·Application pending·0 cites
- 3644US2006204652A1Method for contacting circuit board conductors of a printed circuit boardLPKF LASER & ELECTRONICS AG·Filed 2006·Application pending·0 cites
- 3743US12221376B2Method for producing a glass-plastic connectionLPKF LASER & ELECTRONICS AG·Filed 2020·Granted Feb 11, 2025·0 cites·16 claims
- 3843US11515259B2Method and device for the integration of semiconductor wafersLPKF LASER & ELECTRONICS AG·Filed 2018·Granted Nov 29, 2022·0 cites·31 claims
- 3943US2015021841A1Beam-supported joining machine, in particular laser transmission welding deviceLPKF LASER & ELECTRONICS AG·Filed 2013·Application pending·0 cites
- 4042US2005147740A1Method of applying a cover layer to a structured base layerLPKF LASER & ELECTRONICS AG·Filed 2004·Application pending·0 cites
- 4141US11610784B2Method for introducing at least one cutout or aperture into a sheetlike workpieceLPKF LASER & ELECTRONICS AG·Filed 2015·Granted Mar 21, 2023·0 cites·21 claims
- 4240US7415927B2Procedure for positioning a through-hole in a substrateLPKF LASER & ELECTRONICS AG·Filed 2005·Granted Aug 26, 2008·0 cites·12 claims
- 4340US6529532B2Apparatus for frequency conversion of a laserLPKF LASER & ELECTRONICS AG·Filed 2001·Granted Mar 4, 2003·1 cites·4 claims
- 4440US2023096742A1Mounting method for an integrated semiconductor wafer device, and mounting device able to be used thereforLPKF LASER & ELECTRONICS AG·Filed 2021·Application pending·0 cites
- 4539US2015251272A1Device for position control of a laser machining beamLPKF LASER & ELECTRONICS AG·Filed 2013·Application pending·0 cites
- 4635US6178812B1Methods for measuring the sorbate content of substratesLPKF LASER & ELECTRONICS AG·Filed 1998·Granted Jan 30, 2001·7 cites·19 claims
- 4735US2004247001A1Laser configuration with resonator internal frequency conversionLPKF LASER & ELECTRONICS AG·Filed 2004·Application pending·0 cites
- 4834US9849692B2Method and apparatus for transferring a printing substance onto a substrate by means of laser radiationLPKF LASER & ELECTRONICS AG·Filed 2017·Granted Dec 26, 2017·0 cites·17 claims
- 4929US2011222572A1Laser arrangementLPKF LASER & ELECTRONICS AG·Filed 2011·Application pending·0 cites
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