Assignee
LOW BOON YEW
MY·7 granted patents·2 pending applications·17 citations·filing 2010–2015
Top patents by PatentIndex Score
9 records- 0189US8338236B1Vented substrate for semiconductor deviceLOW BOON YEW·Filed 2011·Granted Dec 25, 2012·12 cites·4 claims
- 0273US9418929B1Integrated circuit with sewn interconnectsLOW BOON YEW·Filed 2015·Granted Aug 16, 2016·3 cites·18 claims
- 0362US8698288B1Flexible substrate with crimping interconnectionLOW BOON YEW·Filed 2013·Granted Apr 15, 2014·2 cites·16 claims
- 0444US8643189B1Packaged semiconductor die with power rail padsLOW BOON YEW·Filed 2012·Granted Feb 4, 2014·0 cites·20 claims
- 0542US9165862B1Semiconductor device with plated through holesLOW BOON YEW·Filed 2014·Granted Oct 20, 2015·0 cites·16 claims
- 0642US2014374891A1Semiconductor device with heat spreader and thermal sheetLOW BOON YEW·Filed 2013·Application pending·0 cites
- 0740US2015118802A1Dual corner top gate moldingLOW BOON YEW·Filed 2014·Application pending·0 cites
- 0839US8338828B2Semiconductor package and method of testing sameLOW BOON YEW·Filed 2010·Granted Dec 25, 2012·0 cites·10 claims
- 0934US9351407B1Method for forming multilayer device having solder filled via connectionLOW BOON YEW·Filed 2015·Granted May 24, 2016·0 cites·5 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →