Assignee
LOOMIA TECH INC
US·8 granted patents·5 pending applications·10 citations·filing 2018–2025
Top patents by PatentIndex Score
13 records- 0188US11798891B2Electronic components for soft, flexible circuitry layers and methods thereforLOOMIA TECH INC·Filed 2022·Granted Oct 24, 2023·1 cites·20 claims
- 0286US10716341B2Flexible circuits and methods thereforLOOMIA TECH INC·Filed 2018·Granted Jul 21, 2020·3 cites·9 claims
- 0383US10490507B1Electronic components for soft, flexible circuitry layers and methods thereforLOOMIA TECH INC·Filed 2018·Granted Nov 26, 2019·4 cites·15 claims
- 0482US11342271B2Electronic components for soft, flexible circuitry layers and methods thereforLOOMIA TECH INC·Filed 2019·Granted May 24, 2022·2 cites·20 claims
- 0581US12230579B2Electronic components for soft, flexible circuitry layers and methods thereforLOOMIA TECH INC·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 0680US2025048559A1Drapable, flexible circuitry layers and methods thereforLOOMIA TECH INC·Filed 2024·Application pending·0 cites
- 0776US2025167127A1Electronic components for soft, flexible circuitry layers and methods thereforLOOMIA TECH INC·Filed 2025·Application pending·0 cites
- 0871US2025169555A1Flexible pressure sensors and user interfacesLOOMIA TECH INC·Filed 2025·Application pending·0 cites
- 0969US12089338B2Flexible circuitry device manufacturing methodLOOMIA TECH INC·Filed 2021·Granted Sep 10, 2024·0 cites·9 claims
- 1063US12232548B2Flexible pressure sensors and user interfacesLOOMIA TECH INC·Filed 2020·Granted Feb 25, 2025·0 cites·12 claims
- 1154US10925168B2Methods for forming of flexible circuitry layersLOOMIA TECH INC·Filed 2018·Granted Feb 16, 2021·0 cites·9 claims
- 1247US2019220919A1Systems, methods, and apparatuses for individual-specific data generated by smart tags of soft goodsLOOMIA TECH INC·Filed 2018·Application pending·0 cites
- 1339US2018317597A1Systems, apparatuses, and methods for heated articleLOOMIA TECH INC·Filed 2018·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →