Assignee
LO CHI KWONG
CN·3 granted patents·29 citations·filing 2010–2010
Top patents by PatentIndex Score
3 records- 0183US8809974B2Semiconductor package for MEMS device and method of manufacturing sameLO CHI KWONG·Filed 2010·Granted Aug 19, 2014·10 cites·28 claims
- 0283US8742569B2Semiconductor package configured to electrically couple to a printed circuit board and method of providing sameLO CHI KWONG·Filed 2010·Granted Jun 3, 2014·11 cites·23 claims
- 0379US8853564B2Air cavity package configured to electrically couple to a printed circuit board and method of providing sameLO CHI KWONG·Filed 2010·Granted Oct 7, 2014·8 cites·24 claims
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