Assignee
LIN YAOJIAN
SG·72 granted patents·2 pending applications·1,010 citations·filing 2006–2013
Top patents by PatentIndex Score
74 records- 0198US9679863B2Semiconductor device and method of forming interconnect substrate for FO-WLCSPLIN YAOJIAN·Filed 2011·Granted Jun 13, 2017·59 cites·5 claims
- 0298US9385006B2Semiconductor device and method of forming an embedded SOP fan-out packageLIN YAOJIAN·Filed 2012·Granted Jul 5, 2016·71 cites·32 claims
- 0398US9082806B2Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSPLIN YAOJIAN·Filed 2011·Granted Jul 14, 2015·72 cites·20 claims
- 0498US8810024B2Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect unitsLIN YAOJIAN·Filed 2012·Granted Aug 19, 2014·62 cites·32 claims
- 0598US8796846B2Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSPLIN YAOJIAN·Filed 2009·Granted Aug 5, 2014·108 cites·32 claims
- 0698US8193604B2Semiconductor package with semiconductor core structure and method of forming the sameLIN YAOJIAN·Filed 2010·Granted Jun 5, 2012·152 cites·24 claims
- 0797US8592992B2Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSPLIN YAOJIAN·Filed 2011·Granted Nov 26, 2013·34 cites·30 claims
- 0897US8445323B2Semiconductor package with semiconductor core structure and method of forming sameLIN YAOJIAN·Filed 2012·Granted May 21, 2013·37 cites·28 claims
- 0995US9385009B2Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSPLIN YAOJIAN·Filed 2011·Granted Jul 5, 2016·55 cites·24 claims
- 1094US8907476B2Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulationLIN YAOJIAN·Filed 2012·Granted Dec 9, 2014·12 cites·24 claims
- 1194US8456002B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefLIN YAOJIAN·Filed 2011·Granted Jun 4, 2013·13 cites·25 claims
- 1294US8168470B2Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compoundLIN YAOJIAN·Filed 2008·Granted May 1, 2012·28 cites·27 claims
- 1393US8445990B2Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor dieLIN YAOJIAN·Filed 2010·Granted May 21, 2013·18 cites·24 claims
- 1493US8409926B2Semiconductor device and method of forming insulating layer around semiconductor dieLIN YAOJIAN·Filed 2010·Granted Apr 2, 2013·12 cites·24 claims
- 1592US8975111B2Wafer level die integration and method thereforLIN YAOJIAN·Filed 2011·Granted Mar 10, 2015·12 cites·34 claims
- 1692US8648470B2Semiconductor device and method of forming FO-WLCSP with multiple encapsulantsLIN YAOJIAN·Filed 2011·Granted Feb 11, 2014·12 cites·24 claims
- 1792US8624353B2Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layerLIN YAOJIAN·Filed 2011·Granted Jan 7, 2014·13 cites·30 claims
- 1892US8513812B2Semiconductor device and method of forming integrated passive deviceLIN YAOJIAN·Filed 2012·Granted Aug 20, 2013·12 cites·23 claims
- 1989US9082780B2Semiconductor device and method of forming a robust fan-out package including vertical interconnects and mechanical support layerLIN YAOJIAN·Filed 2012·Granted Jul 14, 2015·10 cites·25 claims
- 2089US8492203B2Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layersLIN YAOJIAN·Filed 2011·Granted Jul 23, 2013·10 cites·13 claims
- 2188US8912648B2Semiconductor device and method of forming compliant stress relief buffer around large array WLCSPLIN YAOJIAN·Filed 2011·Granted Dec 16, 2014·6 cites·28 claims
- 2288US8164158B2Semiconductor device and method of forming integrated passive deviceLIN YAOJIAN·Filed 2009·Granted Apr 24, 2012·14 cites·23 claims
- 2386US8183087B2Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete componentLIN YAOJIAN·Filed 2008·Granted May 22, 2012·12 cites·16 claims
- 2485US8310058B2Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structuresLIN YAOJIAN·Filed 2010·Granted Nov 13, 2012·6 cites·26 claims
- 2585US8304339B2Solder bump with inner core pillar in semiconductor packageLIN YAOJIAN·Filed 2011·Granted Nov 6, 2012·6 cites·21 claims
- 2685US8304904B2Semiconductor device with solder bump formed on high topography plated Cu padsLIN YAOJIAN·Filed 2010·Granted Nov 6, 2012·6 cites·18 claims
- 2784US8592311B2Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structuresLIN YAOJIAN·Filed 2012·Granted Nov 26, 2013·5 cites·24 claims
- 2884US8487438B2Integrated circuit system having different-size solder bumps and different-size bonding padsLIN YAOJIAN·Filed 2009·Granted Jul 16, 2013·10 cites·4 claims
- 2983US9484259B2Semiconductor device and method of forming protection and support structure for conductive interconnect structureLIN YAOJIAN·Filed 2011·Granted Nov 1, 2016·7 cites·7 claims
- 3083US8409970B2Semiconductor device and method of making integrated passive devicesLIN YAOJIAN·Filed 2007·Granted Apr 2, 2013·10 cites·32 claims
- 3183US8263437B2Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuitLIN YAOJIAN·Filed 2008·Granted Sep 11, 2012·7 cites·29 claims
- 3283US8183095B2Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulationLIN YAOJIAN·Filed 2011·Granted May 22, 2012·4 cites·20 claims
- 3383US8158510B2Semiconductor device and method of forming IPD on molded substrateLIN YAOJIAN·Filed 2009·Granted Apr 17, 2012·9 cites·28 claims
- 3483US8110477B2Semiconductor device and method of forming high-frequency circuit structure and method thereofLIN YAOJIAN·Filed 2010·Granted Feb 7, 2012·6 cites·25 claims
- 3582US9275877B2Semiconductor device and method of forming semiconductor package using panel form carrierLIN YAOJIAN·Filed 2011·Granted Mar 1, 2016·6 cites·25 claims
- 3682US8900929B2Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formationLIN YAOJIAN·Filed 2012·Granted Dec 2, 2014·5 cites·32 claims
- 3782US8610286B2Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in Fo-WLCSPLIN YAOJIAN·Filed 2011·Granted Dec 17, 2013·5 cites·25 claims
- 3882US8502339B2System-in-package having integrated passive devices and method thereforLIN YAOJIAN·Filed 2010·Granted Aug 6, 2013·5 cites·35 claims
- 3981US8124490B2Semiconductor device and method of forming passive devicesLIN YAOJIAN·Filed 2007·Granted Feb 28, 2012·9 cites·32 claims
- 4080US8309452B2Method of forming an inductor on a semiconductor waferLIN YAOJIAN·Filed 2010·Granted Nov 13, 2012·4 cites·24 claims
- 4179US9865482B2Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete componentLIN YAOJIAN·Filed 2012·Granted Jan 9, 2018·4 cites·20 claims
- 4279US9460951B2Semiconductor device and method of wafer level package integrationLIN YAOJIAN·Filed 2011·Granted Oct 4, 2016·5 cites·26 claims
- 4378US9349723B2Semiconductor device and method of forming passive devicesLIN YAOJIAN·Filed 2012·Granted May 24, 2016·4 cites·14 claims
- 4478US8575018B2Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation areaLIN YAOJIAN·Filed 2009·Granted Nov 5, 2013·7 cites·24 claims
- 4578US8241952B2Semiconductor device and method of forming IPD in fan-out level chip scale packageLIN YAOJIAN·Filed 2010·Granted Aug 14, 2012·4 cites·19 claims
- 4675US10192801B2Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compoundLIN YAOJIAN·Filed 2012·Granted Jan 29, 2019·3 cites·26 claims
- 4775US8791008B2Semiconductor device and method of forming micro-vias partially through insulating material over bump interconnect conductive layer for stress reliefLIN YAOJIAN·Filed 2012·Granted Jul 29, 2014·3 cites·25 claims
- 4875US8791006B2Semiconductor device and method of forming an inductor on polymer matrix composite substrateLIN YAOJIAN·Filed 2010·Granted Jul 29, 2014·3 cites·24 claims
- 4974US9601434B2Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structureLIN YAOJIAN·Filed 2010·Granted Mar 21, 2017·3 cites·24 claims
- 5074US8501618B2Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axisLIN YAOJIAN·Filed 2011·Granted Aug 6, 2013·3 cites·25 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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