Assignee
LIN WEN-YI
TW·8 granted patents·1 pending application·60 citations·filing 1991–2011
Top patents by PatentIndex Score
9 records- 0188US7766260B2ShowerheadLIN WEN-YI·Filed 2008·Granted Aug 3, 2010·22 cites·6 claims
- 0284US8462510B2Board-level package with tuned mass damping structureLIN WEN-YI·Filed 2011·Granted Jun 11, 2013·7 cites·20 claims
- 0383US9887144B2Ring structure for chip packagingLIN WEN YI·Filed 2011·Granted Feb 6, 2018·7 cites·20 claims
- 0478US8779582B2Compliant heat spreader for flip chip packaging having thermally-conductive element with different metal material areasLIN WEN-YI·Filed 2011·Granted Jul 15, 2014·5 cites·27 claims
- 0575US8976529B2Lid design for reliability enhancement in flip chip packageLIN WEN-YI·Filed 2011·Granted Mar 10, 2015·4 cites·20 claims
- 0664US8146617B2Check valveLIN WEN YI·Filed 2009·Granted Apr 3, 2012·3 cites·10 claims
- 0750US8946888B2Package on packaging structure and methods of making sameLIN WEN-YI·Filed 2011·Granted Feb 3, 2015·0 cites·27 claims
- 0840US5215274ASupporting device for toilet tissueLIN WEN YI·Filed 1991·Granted Jun 1, 1993·12 cites·3 claims
- 0940US2013119529A1Semiconductor device having lid structure and method of making sameLIN WEN-YI·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →