Assignee
LIN JING-CHENG
TW·30 granted patents·5 pending applications·2,842 citations·filing 2004–2012
Top patents by PatentIndex Score
35 records- 0199US9443783B23DIC stacking device and method of manufactureLIN JING-CHENG·Filed 2012·Granted Sep 13, 2016·891 cites·20 claims
- 0299US8703542B2Wafer-level packaging mechanismsLIN JING-CHENG·Filed 2012·Granted Apr 22, 2014·584 cites·20 claims
- 0398US9000584B2Packaged semiconductor device with a molding compound and a method of forming the sameLIN JING-CHENG·Filed 2011·Granted Apr 7, 2015·1k cites·20 claims
- 0498US8779599B2Packages including active dies and dummy dies and methods for forming the sameLIN JING-CHENG·Filed 2011·Granted Jul 15, 2014·48 cites·14 claims
- 0598US8643148B2Chip-on-Wafer structures and methods for forming the sameLIN JING-CHENG·Filed 2012·Granted Feb 4, 2014·116 cites·19 claims
- 0697US8592995B2Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bumpLIN JING-CHENG·Filed 2010·Granted Nov 26, 2013·34 cites·20 claims
- 0796US8338939B2TSV formation processes using TSV-last approachLIN JING-CHENG·Filed 2010·Granted Dec 25, 2012·22 cites·20 claims
- 0892US8247285B2N-FET with a highly doped source/drain and strain boosterLIN JING-CHENG·Filed 2008·Granted Aug 21, 2012·20 cites·18 claims
- 0991US9219016B2Structure design for 3DIC testingLIN JING-CHENG·Filed 2011·Granted Dec 22, 2015·14 cites·15 claims
- 1090US8970035B2Bump structures for semiconductor packageLIN JING-CHENG·Filed 2012·Granted Mar 3, 2015·9 cites·14 claims
- 1189US8872326B2Three dimensional (3D) fan-out packaging mechanismsLIN JING-CHENG·Filed 2012·Granted Oct 28, 2014·6 cites·20 claims
- 1288US8828848B2Die structure and method of fabrication thereofLIN JING-CHENG·Filed 2011·Granted Sep 9, 2014·10 cites·21 claims
- 1387US8922004B2Copper bump structures having sidewall protection layersLIN JING-CHENG·Filed 2010·Granted Dec 30, 2014·9 cites·20 claims
- 1485US8338884B2Selective epitaxial growth of semiconductor materials with reduced defectsLIN JING-CHENG·Filed 2010·Granted Dec 25, 2012·5 cites·18 claims
- 1584US9245773B2Semiconductor device packaging methods and structures thereofLIN JING-CHENG·Filed 2012·Granted Jan 26, 2016·6 cites·20 claims
- 1684US8963334B2Die-to-die gap control for semiconductor structure and methodLIN JING-CHENG·Filed 2011·Granted Feb 24, 2015·6 cites·20 claims
- 1784US8124513B2Germanium field effect transistors and fabrication thereofLIN JING-CHENG·Filed 2009·Granted Feb 28, 2012·7 cites·18 claims
- 1882US9293366B2Through-substrate vias with improved connectionsLIN JING-CHENG·Filed 2010·Granted Mar 22, 2016·4 cites·18 claims
- 1982US8395215B2Germanium field effect transistors and fabrication thereofLIN JING-CHENG·Filed 2012·Granted Mar 12, 2013·4 cites·20 claims
- 2080US9006004B2Probing chips during package formationLIN JING-CHENG·Filed 2012·Granted Apr 14, 2015·4 cites·20 claims
- 2179US9679783B2Molding wafer chamberLIN JING-CHENG·Filed 2011·Granted Jun 13, 2017·4 cites·23 claims
- 2279US9646942B2Mechanisms for controlling bump height variationLIN JING-CHENG·Filed 2012·Granted May 9, 2017·3 cites·20 claims
- 2377US9418876B2Method of three dimensional integrated circuit assemblyLIN JING-CHENG·Filed 2011·Granted Aug 16, 2016·4 cites·21 claims
- 2477US8698308B2Bump structural designs to minimize package defectsLIN JING-CHENG·Filed 2012·Granted Apr 15, 2014·3 cites·20 claims
- 2570US8653658B2Planarized bumps for underfill controlLIN JING-CHENG·Filed 2011·Granted Feb 18, 2014·2 cites·20 claims
- 2669US9117682B2Methods of packaging semiconductor devices and structures thereofLIN JING-CHENG·Filed 2011·Granted Aug 25, 2015·1 cites·18 claims
- 2769US8540506B2Semiconductor molding chamberLIN JING-CHENG·Filed 2010·Granted Sep 24, 2013·2 cites·20 claims
- 2868US8975183B2Process for forming semiconductor structureLIN JING-CHENG·Filed 2012·Granted Mar 10, 2015·2 cites·18 claims
- 2965US8569086B2Semiconductor device and method of dicing semiconductor devicesLIN JING-CHENG·Filed 2011·Granted Oct 29, 2013·1 cites·18 claims
- 3051US8395221B2Depletion-free MOS using atomic-layer dopingLIN JING-CHENG·Filed 2010·Granted Mar 12, 2013·0 cites·19 claims
- 3151US2010181626A1Methods for Forming NMOS and PMOS Devices on Germanium-Based SubstratesLIN JING-CHENG·Filed 2009·Application pending·0 cites
- 3248US2013087951A1Molding Chamber Apparatus and Curing MethodLIN JING-CHENG·Filed 2011·Application pending·0 cites
- 3340US2013075892A1Method for Three Dimensional Integrated Circuit FabricationLIN JING-CHENG·Filed 2011·Application pending·0 cites
- 3439US2006099802A1Diffusion barrier for damascene structuresLIN JING-CHENG·Filed 2004·Application pending·0 cites
- 3539US2005266679A1Barrier structure for semiconductor devicesLIN JING-CHENG·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when LIN JING-CHENG files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →