Assignee
LIN HUNG-CHIH
TW·4 granted patents·2 pending applications·20 citations·filing 2005–2013
Top patents by PatentIndex Score
6 records- 0189US8421073B2Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC)LIN HUNG-CHIH·Filed 2011·Granted Apr 16, 2013·10 cites·20 claims
- 0283US8573811B2Backlight module with heat dissipating element and heat sinkLIN HUNG-CHIH·Filed 2011·Granted Nov 5, 2013·7 cites·4 claims
- 0375US8956889B2Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC)LIN HUNG-CHIH·Filed 2013·Granted Feb 17, 2015·3 cites·20 claims
- 0449US8573794B2Backlight moduleLIN HUNG-CHIH·Filed 2011·Granted Nov 5, 2013·0 cites·10 claims
- 0543US2011299296A1Backlight module and heat dissipation moduleLIN HUNG-CHIH·Filed 2011·Application pending·0 cites
- 0640US2007060219A1Sliding shellLIN HUNG-CHIH·Filed 2005·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →