Assignee
LIN HSIU-JEN
TW·5 granted patents·1 pending application·20 citations·filing 2010–2021
Top patents by PatentIndex Score
6 records- 0190US8440503B1Methods for performing reflow in bonding processesLIN HSIU-JEN·Filed 2011·Granted May 14, 2013·13 cites·19 claims
- 0282US8236687B2Die-bonding method of LED chip and LED manufactured by the sameLIN HSIU-JEN·Filed 2010·Granted Aug 7, 2012·6 cites·9 claims
- 0379US12086103B2Intelligent storage system and an intelligent storage method thereofLIN HSIU JEN·Filed 2021·Granted Sep 10, 2024·1 cites·7 claims
- 0448US8716737B2Die-bonded LEDLIN HSIU JEN·Filed 2012·Granted May 6, 2014·0 cites·3 claims
- 0544US10784221B2Method of processing solder bump by vacuum annealingLIN HSIU JEN·Filed 2011·Granted Sep 22, 2020·0 cites·20 claims
- 0639US2013334561A1Method for bonding led wafer, method for manufacturing led chip and bonding structureLIN HSIU-JEN·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →