Assignee
LIN CHIA-SHENG
TW·9 granted patents·67 citations·filing 2006–2012
Top patents by PatentIndex Score
9 records- 0194US8901701B2Chip package and fabrication method thereofLIN CHIA-SHENG·Filed 2012·Granted Dec 2, 2014·18 cites·20 claims
- 0292US7360753B1Cable tightening device having anti-theft functionLIN CHIA-SHENG·Filed 2006·Granted Apr 22, 2008·31 cites·19 claims
- 0387US8952519B2Chip package and fabrication method thereofLIN CHIA-SHENG·Filed 2010·Granted Feb 10, 2015·8 cites·18 claims
- 0473US8878367B2Substrate structure with through viasLIN CHIA-SHENG·Filed 2011·Granted Nov 4, 2014·4 cites·19 claims
- 0571US8432032B2Chip package and fabrication method thereofLIN CHIA-SHENG·Filed 2010·Granted Apr 30, 2013·3 cites·24 claims
- 0666US9768223B2Electronics device package and fabrication method thereofLIN CHIA-SHENG·Filed 2011·Granted Sep 19, 2017·2 cites·15 claims
- 0759US8786093B2Chip package and method for forming the sameLIN CHIA-SHENG·Filed 2012·Granted Jul 22, 2014·1 cites·20 claims
- 0847US8097929B2Electronics device package and fabrication method thereofLIN CHIA-SHENG·Filed 2009·Granted Jan 17, 2012·0 cites·9 claims
- 0942US9653500B2Optical cover plate with improved solder mask dam on glass for image sensor package and fabrication method thereofLIN CHIA-SHENG·Filed 2011·Granted May 16, 2017·0 cites·24 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →