Assignee
LIN CHI CHIH
TW·0 granted patents·3 pending applications·0 citations·filing 2007–2011
Top patents by PatentIndex Score
3 records- 0138US2008135939A1Fabrication method of semiconductor package and structure thereofLIN CHI CHIH·Filed 2007·Application pending·0 cites
- 0237US2008182360A1Fabrication method of semiconductor packageLIN CHI CHIH·Filed 2007·Application pending·0 cites
- 0332US2011316016A1Led chip package structureLIN CHI CHIH·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →