Assignee
LIM WON-CHUL
KR·3 granted patents·1 pending application·1 citations·filing 2006–2014
Top patents by PatentIndex Score
4 records- 0159US8870047B2Wafer dicing press and method and semiconductor wafer dicing system including the sameLIM WON-CHUL·Filed 2011·Granted Oct 28, 2014·1 cites·15 claims
- 0251US9252055B2Wafer dicing press and method and semiconductor wafer dicing system including the sameLIM WON-CHUL·Filed 2014·Granted Feb 2, 2016·0 cites·5 claims
- 0344US8159831B2Printed circuit board for accomplishing narrow scribe lane and semiconductor package including the printed circuit boardLIM WON-CHUL·Filed 2009·Granted Apr 17, 2012·0 cites·20 claims
- 0435US2007029650A1Semiconductor package and package stacking structure and method using the sameLIM WON-CHUL·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →