Assignee
LIGHTEN CORP
TW·0 granted patents·3 pending applications·0 citations·filing 2014–2015
Top patents by PatentIndex Score
3 records- 0127US2015014839A1Electronic Element Packaging Structure and Carrier Substrate ThereofLIGHTEN CORP·Filed 2014·Application pending·0 cites
- 0216US2016056128A1Chip package module and package substrateLIGHTEN CORP·Filed 2015·Application pending·0 cites
- 037US2015342058A1Method for manufacturing heat conducting substrateLIGHTEN CORP·Filed 2015·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →