Assignee
LIAO HONGMEI
US·3 granted patents·1 pending application·3 citations·filing 2009–2011
Top patents by PatentIndex Score
4 records- 0161US8797054B2Thermal and stress gradient based RC extraction, timing and power analysisLIAO HONGMEI·Filed 2011·Granted Aug 5, 2014·3 cites·26 claims
- 0243US9293408B2Adding symmetrical filling material in an integrated circuit layoutLIAO HONGMEI·Filed 2009·Granted Mar 22, 2016·0 cites·26 claims
- 0342US8103994B2Generating cutting forms along current flow direction in a circuit layoutLIAO HONGMEI·Filed 2009·Granted Jan 24, 2012·0 cites·23 claims
- 0435US2012110531A1Defect and yield prediction for segments of an integrated circuitLIAO HONGMEI·Filed 2010·Application pending·0 cites
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