Assignee
LI LONGKAI
CN·0 granted patents·8 pending applications·0 citations·filing 2019–2024
Top patents by PatentIndex Score
8 records- 0131US2024244764A1Method for manufacturing multi-layer flexible circuit board and article thereofLI LONGKAI·Filed 2024·Application pending·0 cites
- 0231US2024244763A1Method for coating and forming novel material layer structure of high-frequency circuit board and article thereofLI LONGKAI·Filed 2024·Application pending·0 cites
- 0331US2024284599A1Method for preparing novel material layer structure of circuit board and article thereofLI LONGKAI·Filed 2024·Application pending·0 cites
- 0431US2024244757A1Method for preparing novel material layer structure of high-frequency circuit board and article thereofLI LONGKAI·Filed 2024·Application pending·0 cites
- 0518US2022304165A1Method for coating and forming novel material layer structure of high-frequency circuit board and article thereofLI LONGKAI·Filed 2019·Application pending·0 cites
- 0618US2022272845A1Method for preparing novel material layer structure of circuit board and article thereofLI LONGKAI·Filed 2019·Application pending·0 cites
- 0718US2022304161A1Method for preparing novel material layer structure of high-frequency circuit board and article thereofLI LONGKAI·Filed 2019·Application pending·0 cites
- 0818US2022330437A1Method for manufacturing multi-layer flexible circuit board and article thereofLI LONGKAI·Filed 2019·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →