Assignee
LEUNG WING CHEUK
HK·1 granted patent·1 pending application·1 citations·filing 2017–2020
Top patents by PatentIndex Score
2 records- 0166US10962570B2System, a tangent probe card and a probe head assembly for testing semiconductor waferLEUNG WING CHEUK·Filed 2020·Granted Mar 30, 2021·1 cites·19 claims
- 0234US2018172732A1System, a tangent probe card and a probe head assembly for testing semiconductor wafterLEUNG WING CHEUK·Filed 2017·Application pending·0 cites
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