Assignee
LEE YI JHEN
TW·0 granted patents·3 pending applications·0 citations·filing 2018–2018
Top patents by PatentIndex Score
3 records- 0113US2019172991A1Method for making metal-ceramic laminate heat-dissipating substrate, and electronic device and led comprising the heat-dissipating substrateLEE YI JHEN·Filed 2018·Application pending·0 cites
- 0212US2019103533A1Metal-ceramic composite lead frame structure, manufacturing method thereof, and led using the same structureLEE YI JHEN·Filed 2018·Application pending·0 cites
- 0312US2019115324A1Flexible led filament and assembly thereofLEE YI JHEN·Filed 2018·Application pending·0 cites
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