Assignee
LEE MASAHIRO
JP·3 granted patents·21 citations·filing 2012–2012
Top patents by PatentIndex Score
3 records- 0185US8905680B2Ultrathin wafer transport systemsLEE MASAHIRO·Filed 2012·Granted Dec 9, 2014·8 cites·19 claims
- 0283US8858756B2Ultrathin wafer debonding systemsLEE MASAHIRO·Filed 2012·Granted Oct 14, 2014·7 cites·24 claims
- 0378US9093396B2Silicon interposer systemsLEE MASAHIRO·Filed 2012·Granted Jul 28, 2015·6 cites·21 claims
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