Assignee
LEE LEE HAN MENG@EUGENE
MY·5 granted patents·2 pending applications·10 citations·filing 2009–2017
Top patents by PatentIndex Score
7 records- 0169US8203199B2Tie bar and mold cavity bar arrangements for multiple leadframe stack packageLEE LEE HAN MENG EUGENE·Filed 2009·Granted Jun 19, 2012·6 cites·18 claims
- 0259US8779566B2Flexible routing for high current module applicationLEE LEE HAN MENG EUGENE·Filed 2011·Granted Jul 15, 2014·2 cites·10 claims
- 0358US8105063B1Three piece mold cavity design for packaging integrated circuitsLEE LEE HAN MENG EUGENE·Filed 2010·Granted Jan 31, 2012·1 cites·11 claims
- 0452US8304887B2Module package with embedded substrate and leadframeLEE LEE HAN MENG EUGENE·Filed 2009·Granted Nov 6, 2012·1 cites·13 claims
- 0547US2018122724A1Semiconductor Device Having Leadframe With Pressure-Absorbing Pad StrapsLEE LEE HAN MENG@EUGENE·Filed 2017·Application pending·0 cites
- 0629US2013127029A1Two level leadframe with upset ball bonding surface and device packageLEE LEE HAN MENG EUGENE·Filed 2011·Application pending·0 cites
- 0724US8847370B2Exposed die package that helps protect the exposed die from damageLEE LEE HAN MENG EUGENE·Filed 2011·Granted Sep 30, 2014·0 cites·6 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →