Individual holder
LEE KEVIN J
US·6 granted patents·6 pending applications·92 citations·filing 2005–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
12 records- 0193US8297605B2Multipurpose ball joint assembly and work holding devicesLEE KEVIN J·Filed 2009·Granted Oct 30, 2012·26 cites·9 claims
- 0292US9142510B23D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approachLEE KEVIN J·Filed 2011·Granted Sep 22, 2015·17 cites·19 claims
- 0391US9449913B23D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon viasLEE KEVIN J·Filed 2011·Granted Sep 20, 2016·18 cites·22 claims
- 0489US9489354B1Masking content while preserving layout of a webpageLEE KEVIN J·Filed 2012·Granted Nov 8, 2016·26 cites·20 claims
- 0576US8994174B2Structure having a planar bonding surfaceLEE KEVIN J·Filed 2011·Granted Mar 31, 2015·3 cites·6 claims
- 0658US8910927B2Work holding device for an archery bowLEE KEVIN J·Filed 2012·Granted Dec 16, 2014·2 cites·3 claims
- 0754US2012077706A1Method for assaying protein-protein interactionLEE KEVIN J·Filed 2011·Application pending·0 cites
- 0846US2005287785A1Method of stacking wafers with anisotropic conductive adhesiveLEE KEVIN J·Filed 2005·Application pending·0 cites
- 0946US2009166324A1Full-wafer backside marking processLEE KEVIN J·Filed 2007·Application pending·0 cites
- 1038US2012068342A1Electrically conductive adhesive for temporary bondingLEE KEVIN J·Filed 2010·Application pending·0 cites
- 1136US2008079166A1Managing forces of semiconductor device layersLEE KEVIN J·Filed 2006·Application pending·0 cites
- 1233US2008003715A1Tapered die-side bumpsLEE KEVIN J·Filed 2006·Application pending·0 cites
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