Assignee
LEE HSIN-HUI
TW·2 granted patents·3 pending applications·8 citations·filing 2004–2010
Top patents by PatentIndex Score
5 records- 0184US8647963B2Structure and method of wafer level chip molded packagingLEE HSIN-HUI·Filed 2010·Granted Feb 11, 2014·8 cites·22 claims
- 0251US8288842B2Method for dicing semiconductor wafersLEE HSIN-HUI·Filed 2007·Granted Oct 16, 2012·0 cites·19 claims
- 0342US2009014852A1Flip-Chip Packaging with Stud BumpsLEE HSIN-HUI·Filed 2007·Application pending·0 cites
- 0442US2009008764A1Ultra-Thin Wafer-Level Contact Grid ArrayLEE HSIN-HUI·Filed 2007·Application pending·0 cites
- 0537US2006091562A1Flip chip BGA process and package with stiffener ringLEE HSIN-HUI·Filed 2004·Application pending·0 cites
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