Assignee
LEE CHUANYU
TW·3 granted patents·0 citations·filing 2023–2023
Top patents by PatentIndex Score
3 records- 0143US12259005B2Ball spline assembly and ball reflow component thereofLEE CHUANYU·Filed 2023·Granted Mar 25, 2025·0 cites·16 claims
- 0240US12104645B2Ball retainerLEE CHUANYU·Filed 2023·Granted Oct 1, 2024·0 cites·11 claims
- 0335US12259027B2Ball nut assembly and end component thereofLEE CHUANYU·Filed 2023·Granted Mar 25, 2025·0 cites·12 claims
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