Assignee
LEE CHIH-CHENG
TW·3 granted patents·5 citations·filing 2010–2010
Top patents by PatentIndex Score
3 records- 0177US8322032B2Substrate structure and method for manufacturing the sameLEE CHIH-CHENG·Filed 2010·Granted Dec 4, 2012·4 cites·6 claims
- 0257US8258009B2Circuit substrate and manufacturing method thereof and package structure and manufacturing method thereofLEE CHIH-CHENG·Filed 2010·Granted Sep 4, 2012·1 cites·10 claims
- 0345US8461461B2Embedded substrate having circuit layer element with oblique side surface and method for making the sameLEE CHIH-CHENG·Filed 2010·Granted Jun 11, 2013·0 cites·18 claims
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