Assignee
LEE BAIK-WOO
KR·4 granted patents·1 pending application·75 citations·filing 2006–2015
Top patents by PatentIndex Score
5 records- 0193US8872041B2Multilayer laminate package and method of manufacturing the sameLEE BAIK-WOO·Filed 2011·Granted Oct 28, 2014·24 cites·23 claims
- 0291US8861205B2Folded stacked package and method of manufacturing the sameLEE BAIK-WOO·Filed 2011·Granted Oct 14, 2014·18 cites·20 claims
- 0388US8335084B2Embedded actives and discrete passives in a cavity within build-up layersLEE BAIK-WOO·Filed 2006·Granted Dec 18, 2012·27 cites·9 claims
- 0486US9431374B2Semiconductor packageLEE BAIK-WOO·Filed 2015·Granted Aug 30, 2016·6 cites·19 claims
- 0533US2006258327A1Organic based dielectric materials and methods for minaturized RF components, and low temperature coefficient of permittivity composite devices having tailored filler materialsLEE BAIK-WOO·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →