Assignee
LBSEMICON CO LTD
KR·6 granted patents·2 pending applications·1 citations·filing 2016–2023
Top patents by PatentIndex Score
8 records- 0162US10784228B2Method of manufacturing semiconductor package using side moldingLBSEMICON CO LTD·Filed 2018·Granted Sep 22, 2020·1 cites·14 claims
- 0257US11664297B2Manufacturing method for reflowed solder balls and their under bump metallurgy structureLBSEMICON CO LTD·Filed 2021·Granted May 30, 2023·0 cites·3 claims
- 0355US10629444B2Method for manufacturing bump structureLBSEMICON CO LTD·Filed 2016·Granted Apr 21, 2020·0 cites·16 claims
- 0454US2024162128A1Methods of fabricating semiconductor packageLBSEMICON CO LTD·Filed 2023·Application pending·0 cites
- 0544US10937751B2Bump structure manufacturing methodLBSEMICON CO LTD·Filed 2017·Granted Mar 2, 2021·0 cites·3 claims
- 0641US11127658B2Manufacturing method for reflowed solder balls and their under bump metallurgy structureLBSEMICON CO LTD·Filed 2017·Granted Sep 21, 2021·0 cites·8 claims
- 0734US2019181018A1Method of manufacturing semiconductor package by using both side platingLBSEMICON CO LTD·Filed 2018·Application pending·0 cites
- 0831US10825788B2Method for manufacturing compliant bumpLBSEMICON CO LTD·Filed 2017·Granted Nov 3, 2020·0 cites·14 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →