Assignee
LAU HON SHING
US·5 granted patents·60 citations·filing 2005–2012
Top patents by PatentIndex Score
5 records- 0194US8604603B2Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposersLAU HON SHING·Filed 2010·Granted Dec 10, 2013·33 cites·13 claims
- 0292US9057853B2Apparatus having an embedded 3D hybrid integration for optoelectronic interconnectsLAU HON SHING·Filed 2010·Granted Jun 16, 2015·24 cites·18 claims
- 0367US9490807B2Power reducing logic and non-destructive latch circuits and applicationsLAU HON SHING·Filed 2012·Granted Nov 8, 2016·2 cites·24 claims
- 0457US8305112B2Power reducing logic and non-destructive latch circuits and applicationsLAU HON SHING·Filed 2010·Granted Nov 6, 2012·1 cites·14 claims
- 0540US8421502B2Power reducing logic and non-destructive latch circuits and applicationsLAU HON SHING·Filed 2005·Granted Apr 16, 2013·0 cites·18 claims
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