Assignee
LASERFACTURING INC
CA·2 granted patents·1 pending application·191 citations·filing 2005–2009
Top patents by PatentIndex Score
3 records- 0192US7804043B2Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laserLASERFACTURING INC·Filed 2005·Granted Sep 28, 2010·133 cites·49 claims
- 0291US7528342B2Method and apparatus for via drilling and selective material removal using an ultrafast pulse laserLASERFACTURING INC·Filed 2005·Granted May 5, 2009·58 cites·38 claims
- 0353US2009194516A1Method and apparatus for via drilling and selective material removal using an ultrafast pulse laserLASERFACTURING INC·Filed 2009·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →