Assignee
LAM RES AG
AT·61 granted patents·24 pending applications·145 citations·filing 2004–2023
Top patents by PatentIndex Score
85 records- 0189US10106737B2Liquid mixture and method for selectively wet etching silicon germaniumLAM RES AG·Filed 2017·Granted Oct 23, 2018·8 cites·16 claims
- 0288US10861719B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2020·Granted Dec 8, 2020·2 cites·11 claims
- 0388US10720343B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2016·Granted Jul 21, 2020·5 cites·21 claims
- 0488US9245777B2Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatusLAM RES AG·Filed 2013·Granted Jan 26, 2016·11 cites·20 claims
- 0586US10658204B2Spin chuck with concentrated center and radial heatingLAM RES AG·Filed 2017·Granted May 19, 2020·7 cites·18 claims
- 0682US9147593B2Apparatus for liquid treatment of wafer shaped articlesLAM RES AG·Filed 2012·Granted Sep 29, 2015·6 cites·15 claims
- 0782US9093482B2Method and apparatus for liquid treatment of wafer shaped articlesLAM RES AG·Filed 2012·Granted Jul 28, 2015·6 cites·14 claims
- 0881US10446416B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2016·Granted Oct 15, 2019·3 cites·19 claims
- 0981US9146007B2Apparatus for liquid treatment of work pieces and flow control system for use in sameLAM RES AG·Filed 2012·Granted Sep 29, 2015·10 cites·15 claims
- 1081US7891314B2Fluid discharging deviceLAM RES AG·Filed 2005·Granted Feb 22, 2011·12 cites·7 claims
- 1180US7837803B2Device and method for wet treating disc-shaped articlesLAM RES AG·Filed 2004·Granted Nov 23, 2010·22 cites·2 claims
- 1279US10312117B2Apparatus and radiant heating plate for processing wafer-shaped articlesLAM RES AG·Filed 2016·Granted Jun 4, 2019·3 cites·20 claims
- 1378US9748120B2Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatusLAM RES AG·Filed 2013·Granted Aug 29, 2017·6 cites·11 claims
- 1478US7988818B2Device for liquid treatment of wafer-shaped articlesLAM RES AG·Filed 2006·Granted Aug 2, 2011·5 cites·10 claims
- 1577US11195730B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2019·Granted Dec 7, 2021·2 cites·10 claims
- 1675US9418883B2Device for holding wafer shaped articlesLAM RES AG·Filed 2013·Granted Aug 16, 2016·3 cites·18 claims
- 1772US9870933B2Process and apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2013·Granted Jan 16, 2018·4 cites·1 claims
- 1870US7726323B2Device and process for liquid treatment of wafer-shaped articlesLAM RES AG·Filed 2007·Granted Jun 1, 2010·2 cites·12 claims
- 1969US11823892B2Gas mixture including hydrogen fluoride, alcohol and an additive for preventing stiction of and/or repairing high aspect ratio structuresLAM RES AG·Filed 2019·Granted Nov 21, 2023·1 cites·24 claims
- 2069US9597701B2Apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2013·Granted Mar 21, 2017·2 cites·9 claims
- 2168US9799539B2Method and apparatus for liquid treatment of wafer shaped articlesLAM RES AG·Filed 2014·Granted Oct 24, 2017·4 cites·7 claims
- 2267US9597703B2Slit nozzleLAM RES AG·Filed 2015·Granted Mar 21, 2017·2 cites·20 claims
- 2366US9698029B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2014·Granted Jul 4, 2017·2 cites·13 claims
- 2466US2024038526A1Gas mixture including hydrogen fluoride, alcohol and an additive for preventing stiction of and/or repairing high aspect ratio structuresLAM RES AG·Filed 2023·Application pending·0 cites
- 2565US9779979B2Apparatus for liquid treatment of wafer shaped articlesLAM RES AG·Filed 2014·Granted Oct 3, 2017·2 cites·25 claims
- 2665US9355836B2Method and apparatus for liquid treatment of wafer shaped articlesLAM RES AG·Filed 2013·Granted May 31, 2016·2 cites·15 claims
- 2764US8691022B1Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2012·Granted Apr 8, 2014·1 cites·11 claims
- 2863US2026049963A1Apparatus and method with quartz crystal microbalance and flow cellLAM RES AG·Filed 2023·Application pending·0 cites
- 2961US10815573B2Passivation mixture and systems and methods for selectively passivating substrate materials including germanium or type III-IV materials using the passivation mixtureLAM RES AG·Filed 2017·Granted Oct 27, 2020·0 cites·11 claims
- 3061US10490426B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2014·Granted Nov 26, 2019·1 cites·29 claims
- 3161US9972514B2Apparatus for liquid treatment of wafer shaped articlesLAM RES AG·Filed 2016·Granted May 15, 2018·1 cites·13 claims
- 3261US9536770B2Method and apparatus for liquid treatment of wafer shaped articlesLAM RES AG·Filed 2014·Granted Jan 3, 2017·2 cites·18 claims
- 3360US2025357177A1Device for conveying a wafer-shaped articleLAM RES AG·Filed 2023·Application pending·0 cites
- 3458US8029641B2Device and method for liquid treatment of wafer-shaped articlesLAM RES AG·Filed 2006·Granted Oct 4, 2011·3 cites·14 claims
- 3556US7799695B2Device for liquid treatment of wafer-shaped articlesLAM RES AG·Filed 2004·Granted Sep 21, 2010·4 cites·7 claims
- 3654US2025364304A1System for processing wafer-shaped articlesLAM RES AG·Filed 2023·Application pending·0 cites
- 3753US9548221B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2014·Granted Jan 17, 2017·0 cites·8 claims
- 3849US11345852B2Etchant compositionLAM RES AG·Filed 2019·Granted May 31, 2022·0 cites·13 claims
- 3949US10056287B2Apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2015·Granted Aug 21, 2018·0 cites·19 claims
- 4049US7754019B2Method for removing particles from a semiconductor surfaceLAM RES AG·Filed 2006·Granted Jul 13, 2010·0 cites·13 claims
- 4148US12198945B2Vapor delivery head for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structuresLAM RES AG·Filed 2019·Granted Jan 14, 2025·0 cites·18 claims
- 4248US9685358B2Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatusLAM RES AG·Filed 2016·Granted Jun 20, 2017·0 cites·20 claims
- 4348US2024030050A1Apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2021·Application pending·0 cites
- 4447US10043686B2Apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2013·Granted Aug 7, 2018·0 cites·7 claims
- 4547US9657397B2Apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2013·Granted May 23, 2017·0 cites·13 claims
- 4647US9589818B2Apparatus for liquid treatment of wafer shaped articles and liquid control ring for use in sameLAM RES AG·Filed 2012·Granted Mar 7, 2017·1 cites·13 claims
- 4746US9960057B2Device for measuring the distribution or impulse of a series of dropletsLAM RES AG·Filed 2014·Granted May 1, 2018·0 cites·3 claims
- 4846US2023411177A1Apparatus for processing a wafer-shaped articleLAM RES AG·Filed 2021·Application pending·0 cites
- 4945US2023360952A1Apparatus for processing a waferLAM RES AG·Filed 2021·Application pending·0 cites
- 5044US12538752B2Apparatus for processing a wafer-shaped articleLAM RES AG·Filed 2021·Granted Jan 27, 2026·0 cites·18 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
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