Assignee
KUN YUAN TECHNOLOGY CO LTD
TW·1 granted patent·3 pending applications·0 citations·filing 2008–2009
Technology mixH10W4
Top patents by PatentIndex Score
4 records- 0139US2009294943A1Stacked structure of integrated circuits having space elementsKUN YUAN TECHNOLOGY CO LTD·Filed 2009·Application pending·0 cites
- 0234US2010314748A1Chip packaging method and structure thereofKUN YUAN TECHNOLOGY CO LTD·Filed 2009·Application pending·0 cites
- 0329US2010035380A1Method for fabricating package structure of stacked chipsKUN YUAN TECHNOLOGY CO LTD·Filed 2008·Application pending·0 cites
- 0428US8014163B2Package module for a memory IC chipKUN YUAN TECHNOLOGY CO LTD·Filed 2009·Granted Sep 6, 2011·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when KUN YUAN TECHNOLOGY CO LTD files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →