Assignee
KOIDE SHOHEI
US·11 granted patents·1 pending application·152 citations·filing 2001–2012
Top patents by PatentIndex Score
12 records- 0198US8258265B2Reconstituted polypeptidesKOIDE SHOHEI·Filed 2007·Granted Sep 4, 2012·60 cites·13 claims
- 0296US8263741B2Artificial antibody polypeptidesKOIDE SHOHEI·Filed 2001·Granted Sep 11, 2012·57 cites·29 claims
- 0391US8106162B2Artificial antibody polypeptidesKOIDE SHOHEI·Filed 2007·Granted Jan 31, 2012·7 cites·14 claims
- 0491US8062858B2Artificial antibody polypeptidesKOIDE SHOHEI·Filed 2006·Granted Nov 22, 2011·7 cites·19 claims
- 0584US9413732B2Vehicle network systemKOIDE SHOHEI·Filed 2012·Granted Aug 9, 2016·9 cites·12 claims
- 0683US8263350B2Molecular affinity clamp technology and uses thereofKOIDE SHOHEI·Filed 2010·Granted Sep 11, 2012·5 cites·20 claims
- 0781US9051357B2Reconstituted polypeptidesKOIDE SHOHEI·Filed 2012·Granted Jun 9, 2015·2 cites·9 claims
- 0880US9885050B2Molecular affinity clamp technology and uses thereofKOIDE SHOHEI·Filed 2008·Granted Feb 6, 2018·4 cites·17 claims
- 0980US9127090B2Artificial antibody polypeptidesKOIDE SHOHEI·Filed 2011·Granted Sep 8, 2015·1 cites·21 claims
- 1060US2013267676A1Artificial antibody polypeptidesKOIDE SHOHEI·Filed 2012·Application pending·0 cites
- 1143US8727495B2Liquid droplet discharge apparatus, piezoelectric actuator, and method for producing liquid droplet discharge apparatusKOIDE SHOHEI·Filed 2012·Granted May 20, 2014·0 cites·10 claims
- 1241US8927874B2Flexible wiring substrate, method for assembling flexible wiring substrate, and method for manufacturing liquid jetting apparatusKOIDE SHOHEI·Filed 2012·Granted Jan 6, 2015·0 cites·8 claims
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