Assignee
KO KWANGWOO MICHAEL
US·3 granted patents·6 citations·filing 2007–2013
Top patents by PatentIndex Score
3 records- 0176US9308710B2Pressure control mechanism for adhesive thermal compression bonding machinesKO KWANGWOO MICHAEL·Filed 2013·Granted Apr 12, 2016·5 cites·5 claims
- 0258US8469074B2Pressure control mechanism for adhesive thermal compression bonding machinesKO KWANGWOO MICHAEL·Filed 2009·Granted Jun 25, 2013·1 cites·11 claims
- 0334US8262962B2Die-cut and method of manufacturing or assembling die-cuts from the components thereofKO KWANGWOO MICHAEL·Filed 2007·Granted Sep 11, 2012·0 cites·17 claims
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