Assignee
KO CHANHOON
KR·3 granted patents·162 citations·filing 2010–2011
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0194US8217502B2Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereofKO CHANHOON·Filed 2010·Granted Jul 10, 2012·144 cites·20 claims
- 0286US8304296B2Semiconductor packaging system with multipart conductive pillars and method of manufacture thereofKO CHANHOON·Filed 2010·Granted Nov 6, 2012·13 cites·20 claims
- 0376US8530277B2Integrated circuit packaging system with package on package support and method of manufacture thereofKO CHANHOON·Filed 2011·Granted Sep 10, 2013·5 cites·15 claims
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