Assignee
KASAI MASAKI
JP·3 granted patents·8 citations·filing 2006–2012
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0172US8446008B2Semiconductor device bonding with stress relief connection padsKASAI MASAKI·Filed 2007·Granted May 21, 2013·5 cites·4 claims
- 0267US8164201B2Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulusKASAI MASAKI·Filed 2006·Granted Apr 24, 2012·3 cites·21 claims
- 0351US8664779B2Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulusKASAI MASAKI·Filed 2012·Granted Mar 4, 2014·0 cites·22 claims
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