Assignee
KAO CHIN-FU
TW·4 granted patents·5 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0172US8962392B2Underfill curing method using carrierKAO CHIN-FU·Filed 2012·Granted Feb 24, 2015·3 cites·20 claims
- 0269US8759118B2Plating process and structureKAO CHIN-FU·Filed 2011·Granted Jun 24, 2014·2 cites·20 claims
- 0349US8536573B2Plating process and structureKAO CHIN-FU·Filed 2011·Granted Sep 17, 2013·0 cites·20 claims
- 0443US8953336B2Surface metal wiring structure for an IC substrateKAO CHIN-FU·Filed 2012·Granted Feb 10, 2015·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →