Assignee
JINN P CHU
TW·0 granted patents·2 pending applications·0 citations·filing 2005–2006
Top patents by PatentIndex Score
2 records- 0145US2005252583A1Copper film containing tungsten nitride for improving thermal stability, electrical conductivity and electric leakage properties and a manufacturing method for the copper filmJINN P CHU·Filed 2005·Application pending·0 cites
- 0238US2007281457A1Copper layer and a method for manufacturing said copper layerJINN P CHU·Filed 2006·Application pending·0 cites
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