Assignee
JIN HWAIL
0 granted patents·3 pending applications·0 citations·filing 2004–2010
Top patents by PatentIndex Score
3 records- 0134US2009311520A1Multi-layer adhesive film for die stackingJIN HWAIL·Filed 2005·Application pending·0 cites
- 0231US2005227064A1Dicing die bonding filmJIN HWAIL·Filed 2004·Application pending·0 cites
- 0330US2010279469A1Low-Voiding Die Attach Film, Semiconductor Package, and Processes for Making and Using SameJIN HWAIL·Filed 2010·Application pending·0 cites
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