Assignee
JIANGSU CHANGJIANG ELECTRONICS
CN·5 granted patents·5 pending applications·2 citations·filing 2006–2014
Top patents by PatentIndex Score
10 records- 0163US9209117B2No-exposed-pad quad flat no-lead (QFN) packaging structure and method for manufacturing the sameJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Granted Dec 8, 2015·2 cites·16 claims
- 0241US9209115B2Quad flat no-lead (QFN) packaging structure and method for manufacturing the sameJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Granted Dec 8, 2015·0 cites·13 claims
- 0341US2008258273A1Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the SameJIANGSU CHANGJIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 0441US2008315412A1Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the SameJIANGSU CHANGJIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 0540US9362214B2Pre-encapsulated etching-then-plating lead frame structure with island and method for manufacturing the sameJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Granted Jun 7, 2016·0 cites·6 claims
- 0640US9105622B2Barrel-plating quad flat no-lead (QFN) packaging structures and method for manufacturing the sameJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Granted Aug 11, 2015·0 cites·18 claims
- 0739US9252113B2No-exposed-pad ball grid array (BGA) packaging structures and method for manufacturing the sameJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Granted Feb 2, 2016·0 cites·6 claims
- 0835US2016148861A1First-packaged and later-etched three-dimensional flip-chip system-in-package structure and processing method thereforJIANGSU CHANGJIANG ELECTRONICS·Filed 2013·Application pending·0 cites
- 0933US2016141233A1First-packaged and later-etched normal chip three dimension system-in-package metal circuit board structure and processing method thereofJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Application pending·0 cites
- 1033US2016163622A1Packaging-before-etching flip chip 3d system-level metal circuit board structure and technique thereofJIANGSU CHANGJIANG ELECTRONICS·Filed 2013·Application pending·0 cites
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