Assignee
JIANG WENHUI
US·4 granted patents·2 pending applications·7 citations·filing 2016–2021
Top patents by PatentIndex Score
6 records- 0188US11761296B2Downhole tools comprising degradable componentsJIANG WENHUI·Filed 2021·Granted Sep 19, 2023·2 cites·16 claims
- 0278US10704334B2Polycrystalline diamond compact cutters having protective barrier coatingsJIANG WENHUI·Filed 2018·Granted Jul 7, 2020·4 cites·20 claims
- 0372US10343212B2Hardfacing containing tungsten carbide particles with barrier coating and methods of making the sameJIANG WENHUI·Filed 2016·Granted Jul 9, 2019·1 cites·17 claims
- 0458US10870606B2Polycrystalline diamond comprising nanostructured polycrystalline diamond particles and method of making the sameJIANG WENHUI·Filed 2019·Granted Dec 22, 2020·0 cites·10 claims
- 0547US2019242191A1Polycrystalline Diamond Compact Cutter with Low Cobalt Content Cemented Tungsten Carbide SubstrateJIANG WENHUI·Filed 2019·Application pending·0 cites
- 0632US2018087324A1Polycrystalline Diamond Compact Cutters Having Metallic CoatingsJIANG WENHUI·Filed 2017·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →