Assignee
JIANG HUNT HANG
US·2 granted patents·1 pending application·32 citations·filing 2010–2011
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0193US8604597B2Multi-die packages incorporating flip chip dies and associated packaging methodsJIANG HUNT HANG·Filed 2011·Granted Dec 10, 2013·22 cites·19 claims
- 0287US8283758B2Microelectronic packages with enhanced heat dissipation and methods of manufacturingJIANG HUNT HANG·Filed 2010·Granted Oct 9, 2012·10 cites·7 claims
- 0337US2012193772A1Stacked die packages with flip-chip and wire bonding diesJIANG HUNT HANG·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when JIANG HUNT HANG files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →