Assignee

JFE PREC CORP

JP·1 granted patent·6 citations·filing 2005–2005

Technology mixB22F1 C22C1 C22F1 H10W1

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1 record

0167US7955448B2Alloy for heat dissipation of semiconductor device and semiconductor module, and method of manufacturing alloyJFE PREC CORP·Filed 2005·Granted Jun 7, 2011·6 cites·10 claims

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