Assignee
JCU CORP
JP·7 granted patents·19 pending applications·3 citations·filing 2012–2022
Top patents by PatentIndex Score
26 records- 0169US9865493B2Substrate plating jigJCU CORP·Filed 2012·Granted Jan 9, 2018·2 cites·8 claims
- 0261US11214883B2Plating solution for coloring, and coloring methodJCU CORP·Filed 2017·Granted Jan 4, 2022·0 cites·9 claims
- 0359US2021130969A1Nickel-plating additive and satin nickel-plating bath containing sameJCU CORP·Filed 2021·Application pending·0 cites
- 0458US2024352612A1White trivalent chromium plating bath and white trivalent chromium plating method for object to be plated using sameJCU CORP·Filed 2022·Application pending·0 cites
- 0556US2025179676A1Plating solution containing sulfonio group-containing ether compoundJCU CORP·Filed 2022·Application pending·0 cites
- 0655US12221715B2Microporous plating solution and method of using this plating solution to perform microporous plating on object to be platedJCU CORP·Filed 2020·Granted Feb 11, 2025·0 cites·11 claims
- 0755US10640875B2Wet type processing apparatus for resin filmJCU CORP·Filed 2016·Granted May 5, 2020·1 cites·5 claims
- 0855US2016138181A1Substrate plating deviceJCU CORP·Filed 2014·Application pending·0 cites
- 0955US2017096744A1Packing for substrate plating jig and substrate plating jig using the sameJCU CORP·Filed 2014·Application pending·0 cites
- 1055US2024337039A1Method for coarsening copper crystal grains in objects to be plated and copper-plated membrane having coarsened copper crystal grains in copper-plated membraneJCU CORP·Filed 2022·Application pending·0 cites
- 1154US2024279834A1Additive for composite plating solutionsJCU CORP·Filed 2022·Application pending·0 cites
- 1253US2017044682A1High-speed filling method for copperJCU CORP·Filed 2014·Application pending·0 cites
- 1353US2021317589A1Trivalent chromium plating solution and chromium plating method using sameJCU CORP·Filed 2019·Application pending·0 cites
- 1451US2021172081A1Trivalent chromium plating solution and method for chromium-plating using sameJCU CORP·Filed 2018·Application pending·0 cites
- 1551US2020087791A1Multi-stage resin surface etching method, and plating method on resin using sameJCU CORP·Filed 2018·Application pending·0 cites
- 1651US2021198797A1Trivalent chromium plating solution and trivalent chromium plating method using sameJCU CORP·Filed 2018·Application pending·0 cites
- 1749US2018327922A1Nickel-plating additive and satin nickel-plating bath containing sameJCU CORP·Filed 2015·Application pending·0 cites
- 1848US10533022B2Silicon oligomer and production method thereforJCU CORP·Filed 2017·Granted Jan 14, 2020·0 cites·21 claims
- 1945US2016137673A1Silicon oligomer and production method thereforJCU CORP·Filed 2013·Application pending·0 cites
- 2043US2016130712A1Electroplating solution for tin or tin alloy, and use for sameJCU CORP·Filed 2014·Application pending·0 cites
- 2139US2019090341A1Plasma generating deviceJCU CORP·Filed 2017·Application pending·0 cites
- 2236US11538664B2Plasma treatment apparatus and methodJCU CORP·Filed 2018·Granted Dec 27, 2022·0 cites·18 claims
- 2335US2023193468A1Coating agent for forming oxide film, method for producing oxide film, and method for producing metal-plated structureJCU CORP·Filed 2018·Application pending·0 cites
- 2431US10966327B2Method for forming circuit on substrateJCU CORP·Filed 2016·Granted Mar 30, 2021·0 cites·19 claims
- 2530US2018298515A1Method for managing copper sulfate plating solutionJCU CORP·Filed 2015·Application pending·0 cites
- 2628US2015228461A1Plasma treatment apparatus and methodJCU CORP·Filed 2015·Application pending·0 cites
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