Assignee
J-DEVICES CORP
JP·34 granted patents·7 pending applications·52 citations·filing 2013–2020
Top patents by PatentIndex Score
41 records- 0189US9368474B2Manufacturing method for semiconductor deviceJ DEVICES CORP·Filed 2015·Granted Jun 14, 2016·8 cites·21 claims
- 0286US10236231B2Semiconductor deviceJ DEVICES CORP·Filed 2017·Granted Mar 19, 2019·5 cites·13 claims
- 0386US9635762B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Apr 25, 2017·6 cites·11 claims
- 0485US9837382B2Semiconductor package and manufacturing method thereofJ-DEVICES CORP·Filed 2016·Granted Dec 5, 2017·5 cites·10 claims
- 0581US9786611B2Method for manufacturing a semiconductor packageJ-DEVICES CORP·Filed 2016·Granted Oct 10, 2017·4 cites·15 claims
- 0680US9553052B2Magnetic shielding package of non-volatile magnetic memory elementJ-DEVICES CORP·Filed 2015·Granted Jan 24, 2017·4 cites·4 claims
- 0777US11488886B2Semiconductor deviceJ DEVICES CORP·Filed 2019·Granted Nov 1, 2022·3 cites·20 claims
- 0876US10256196B2Semiconductor device and method for manufacturing sameJ DEVICES CORP·Filed 2016·Granted Apr 9, 2019·3 cites·5 claims
- 0974US9093393B2Semiconductor device and method for producing the sameJ DEVICES CORP·Filed 2013·Granted Jul 28, 2015·4 cites·8 claims
- 1071US10553456B2Semiconductor package and manufacturing method of semiconductor packageJ DEVICES CORP·Filed 2017·Granted Feb 4, 2020·2 cites·13 claims
- 1171US10090276B2Semiconductor package to reduce warpingJ DEVICES CORP·Filed 2015·Granted Oct 2, 2018·2 cites·8 claims
- 1268US10079161B2Method for producing a semiconductor packageJ DEVICES CORP·Filed 2018·Granted Sep 18, 2018·2 cites·5 claims
- 1367US10157760B2Semiconductor manufacturing apparatus having a pickup unit simultaneously picking up a plurality of semiconductor chipsJ DEVICES CORP·Filed 2017·Granted Dec 18, 2018·2 cites·7 claims
- 1464US11322431B2Semiconductor device having outer terminal portions with conductive layer on outer end surfaces and method of manufacturing a semiconductor deviceJ DEVICES CORP·Filed 2020·Granted May 3, 2022·0 cites·16 claims
- 1562US11189553B2Wiring substrate, semiconductor package having the wiring substrate, and manufacturing method thereofJ DEVICES CORP·Filed 2019·Granted Nov 30, 2021·0 cites·20 claims
- 1662US9362200B2Heat sink in the aperture of substrateJ DEVICES CORP·Filed 2015·Granted Jun 7, 2016·1 cites·20 claims
- 1756US8897051B2Semiconductor storage device and method for producing the sameJ DEVICES CORP·Filed 2013·Granted Nov 25, 2014·1 cites·5 claims
- 1855US10910294B2Semiconductor device and method of manufacturing semiconductor deviceJ DEVICES CORP·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
- 1954US10559523B2Semiconductor package and a method for manufacturing a semiconductor deviceJ DEVICES CORP·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
- 2051US2017170106A1Wiring substrate, semiconductor package having the wiring substrate, and manufacturing method thereofJ-DEVICES CORP·Filed 2016·Application pending·0 cites
- 2150US10134710B2Semiconductor packageJ DEVICES CORP·Filed 2017·Granted Nov 20, 2018·0 cites·5 claims
- 2250US10062638B2Semiconductor package and a method for manufacturing a semiconductor deviceJ DEVICES CORP·Filed 2017·Granted Aug 28, 2018·0 cites·3 claims
- 2347US9601450B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Mar 21, 2017·0 cites·15 claims
- 2447US9595488B2Semiconductor deviceJ-DEVICES CORP·Filed 2016·Granted Mar 14, 2017·0 cites·11 claims
- 2546US9922931B2Interconnect structure, printed circuit board, semiconductor device, and manufacturing method for interconnect structureJ DEVICES CORP·Filed 2017·Granted Mar 20, 2018·0 cites·5 claims
- 2646US9721900B2Semiconductor package and its manufacturing methodJ-DEVICES CORP·Filed 2016·Granted Aug 1, 2017·0 cites·18 claims
- 2745US9418944B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Aug 16, 2016·0 cites·11 claims
- 2843US2015243576A1Semiconductor deviceJ DEVICES CORP·Filed 2015·Application pending·0 cites
- 2943US2016233141A1Semiconductor deviceJ-DEVICES CORP·Filed 2016·Application pending·0 cites
- 3042US10388625B2Press fitting head and semiconductor manufacturing apparatus using the sameJ DEVICES CORP·Filed 2016·Granted Aug 20, 2019·0 cites·5 claims
- 3141US9627289B2Semiconductor deviceJ-DEVICES CORP·Filed 2015·Granted Apr 18, 2017·0 cites·6 claims
- 3240US2017373012A1Semiconductor package and method for producing sameJ-DEVICES CORP·Filed 2017·Application pending·0 cites
- 3338US10529635B2Manufacturing method of semiconductor package including laser processingJ DEVICES CORP·Filed 2017·Granted Jan 7, 2020·0 cites·12 claims
- 3438US2017358462A1Manufacturing method of semiconductor packageJ-DEVICES CORP·Filed 2017·Application pending·0 cites
- 3536US2017207157A1Method for manufacturing semiconductor package, and semiconductor packageJ-DEVICES CORP·Filed 2016·Application pending·0 cites
- 3635US9685376B2Semiconductor device and method of manufacturing semiconductor deviceJ-DEVICES CORP·Filed 2015·Granted Jun 20, 2017·0 cites·10 claims
- 3734US10096564B2Manufacturing method of semiconductor packageJ DEVICES CORP·Filed 2017·Granted Oct 9, 2018·0 cites·20 claims
- 3832US9412685B2Semiconductor device and method of manufacturing the sameJ-DEVICES CORP·Filed 2013·Granted Aug 9, 2016·0 cites·10 claims
- 3930US10224256B2Manufacturing method of semiconductor packageJ DEVICES CORP·Filed 2017·Granted Mar 5, 2019·0 cites·17 claims
- 4025US2017256453A1Method of manufacturing semiconductor package and semiconductor packageJ-DEVICES CORP·Filed 2017·Application pending·0 cites
- 4121US9905536B2Semiconductor deviceJ DEVICES CORP·Filed 2016·Granted Feb 27, 2018·0 cites·8 claims
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