Assignee
ITC INTERCIRCUIT ELECTRONIC GMBH
DE·1 granted patent·1 pending application·0 citations·filing 2020–2021
Top patents by PatentIndex Score
2 records- 0135US2023403797A1Method for Filing at least One Hole formed in a Printed Circuit Board, a Printed Circuit Board filled in such a Manner, and a Vehicle Comprising such a Printed Circuit BoardITC INTERCIRCUIT ELECTRONIC GMBH·Filed 2021·Application pending·0 cites
- 0233US11172578B2Filling assemblyITC INTERCIRCUIT ELECTRONIC GMBH·Filed 2020·Granted Nov 9, 2021·0 cites·17 claims
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