Assignee
ISOTRONICS INC
13 granted patents·329 citations·filing 1975–1989
Top patents by PatentIndex Score
13 records- 0178US4453033ALead groundingISOTRONICS INC·Filed 1982·Granted Jun 5, 1984·34 cites·9 claims
- 0275US5015207AMulti-path feed-thru lead and method for formation thereofISOTRONICS INC·Filed 1989·Granted May 14, 1991·52 cites·17 claims
- 0375US4487999AMicrowave chip carrierISOTRONICS INC·Filed 1983·Granted Dec 11, 1984·45 cites·20 claims
- 0468US4266090AAll metal flat packageISOTRONICS INC·Filed 1978·Granted May 5, 1981·25 cites·7 claims
- 0559US4451540ASystem for packaging of electronic circuitsISOTRONICS INC·Filed 1982·Granted May 29, 1984·27 cites·8 claims
- 0658US4008945AUltraviolet-transmitting window for a PROMISOTRONICS INC·Filed 1975·Granted Feb 22, 1977·18 cites·11 claims
- 0756US4716082ADuplex glass preforms for hermetic glass-to-metal sealingISOTRONICS INC·Filed 1986·Granted Dec 29, 1987·19 cites·20 claims
- 0855US4547624AMethod and apparatus for reducing package height for microcircuit packagesISOTRONICS INC·Filed 1983·Granted Oct 15, 1985·18 cites·12 claims
- 0954US4788382ADuplex glass preforms for hermetic glass-to-metal compression sealingISOTRONICS INC·Filed 1987·Granted Nov 29, 1988·27 cites·18 claims
- 1053US4991291AMethod for fabricating a fold-up frameISOTRONICS INC·Filed 1989·Granted Feb 12, 1991·26 cites·10 claims
- 1152US4266089AAll metal flat package having excellent heat transfer characteristicsISOTRONICS INC·Filed 1978·Granted May 5, 1981·13 cites·6 claims
- 1240US4412093AMicrocircuit flat pack with integral shellISOTRONICS INC·Filed 1981·Granted Oct 25, 1983·17 cites·7 claims
- 1340US4262300AMicrocircuit package formed of multi-componentsISOTRONICS INC·Filed 1978·Granted Apr 14, 1981·8 cites·13 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →