Assignee
IRVING SCOTT
US·0 granted patents·2 pending applications·0 citations·filing 2009–2010
Top patents by PatentIndex Score
2 records- 0146US2010230792A1Premolded Substrates with Apertures for Semiconductor Die Packages with Stacked Dice, Said Packages, and Methods of Making the SameIRVING SCOTT·Filed 2009·Application pending·0 cites
- 0241US2012072187A1System for evaluating energy consumptionIRVING SCOTT·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when IRVING SCOTT files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →