Assignee
INVENSAS LLC
US·16 granted patents·4 pending applications·139 citations·filing 2018–2024
Top patents by PatentIndex Score
20 records- 0199US11387202B2Nanowire bonding interconnect for fine-pitch microelectronicsINVENSAS LLC·Filed 2020·Granted Jul 12, 2022·57 cites·15 claims
- 0298US11387214B2Multi-chip modules formed using wafer-level processing of a reconstituted waferINVENSAS LLC·Filed 2019·Granted Jul 12, 2022·61 cites·20 claims
- 0397US11929337B23D-interconnectINVENSAS LLC·Filed 2021·Granted Mar 12, 2024·3 cites·20 claims
- 0497US11810867B2Wire bond wires for interference shieldingINVENSAS LLC·Filed 2022·Granted Nov 7, 2023·2 cites·28 claims
- 0593US12040284B23D-interconnect with electromagnetic interference (“EMI”) shield and/or antennaINVENSAS LLC·Filed 2021·Granted Jul 16, 2024·2 cites·20 claims
- 0691US11599299B23D memory circuitINVENSAS LLC·Filed 2020·Granted Mar 7, 2023·2 cites·14 claims
- 0790US11462483B2Wire bond wires for interference shieldingINVENSAS LLC·Filed 2019·Granted Oct 4, 2022·3 cites·24 claims
- 0887US11495579B2Capacitive coupling in a direct-bonded interface for microelectronic devicesINVENSAS LLC·Filed 2020·Granted Nov 8, 2022·1 cites·12 claims
- 0986US11398258B2Multi-die module with low power operationINVENSAS LLC·Filed 2019·Granted Jul 26, 2022·4 cites·24 claims
- 1082US12154858B2Connecting multiple chips using an interconnect deviceINVENSAS LLC·Filed 2020·Granted Nov 26, 2024·1 cites·23 claims
- 1182US11605614B2Correction die for wafer/die stackINVENSAS LLC·Filed 2020·Granted Mar 14, 2023·1 cites·17 claims
- 1278USRE49987EMultiple plated via arrays of different wire heights on a same substrateINVENSAS LLC·Filed 2022·Granted May 28, 2024·0 cites·43 claims
- 1378US11735563B2Package-on-package assembly with wire bond viasINVENSAS LLC·Filed 2021·Granted Aug 22, 2023·0 cites·8 claims
- 1477US11369020B2Stacked transmission lineINVENSAS LLC·Filed 2018·Granted Jun 21, 2022·2 cites·18 claims
- 1574US2024339418A13d-interconnect with electromagnetic interference ("emi") shield and/or antennaINVENSAS LLC·Filed 2024·Application pending·0 cites
- 1672US12021041B2Region shielding within a package of a microelectronic deviceINVENSAS LLC·Filed 2021·Granted Jun 25, 2024·0 cites·19 claims
- 1762US11804469B2Active bridging apparatusINVENSAS LLC·Filed 2020·Granted Oct 31, 2023·0 cites·20 claims
- 1855US2023069183A1Stacked structure with interposerINVENSAS LLC·Filed 2022·Application pending·0 cites
- 1955US2023122531A1Reduced parasitic capacitance in bonded structuresINVENSAS LLC·Filed 2022·Application pending·0 cites
- 2055US2023130259A1Radio frequency device packagesINVENSAS LLC·Filed 2022·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →